6-layer core board PCB production

  • Number of layers:   6

  • Substrate:   FR4 Tg150

  • Board thickness:   1.2mm

  • Panel size:   118*92mm/10

  • Outer copper thickness:   35μm

  • Inner copper thickness:   30μm

  • Minimum via:   0.20mm

  • Minimum BGA:   0.25mm

  • Line width/spacing:   3/3mil

  • Surface treatment:   ENIG 2U"

  • Special process:   3-side half hole

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