6-layer 1-stage HDI

  • Layer:   1+4+1

  • Material:   FR4 Tg150

  • Board Thickness:   1.6mm

  • Panel Size:   105*95mm/1

  • Outer Copper Thickness:   35μm

  • Inner Copper Thickness:   30μm

  • Minimum Pinhole:   0.20mm

  • Minimum Blind Hole:   0.10mm

  • Minimum BGA:   0.20mm

  • Line Width/Spacing:   3/3mil

  • Surface Finish:   ENIG 2μ''+OSP

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