4-layer impedance gold finger circuit board

  • Application Industry:   Internet of Things

  • Application Product:   Server

  • Layers:   4

  • Special Process:   Impedance

  • Surface Treatment:   ENIG (Electroless Nickel Immersion Gold) Gold Finger Electroplating

  • Material:   FR4

  • Outer Layer Line Width/Space:   5/3.5 mil

  • Inner Layer Line Width/Space:   20/6 mil

  • Board Thickness:   1.6 mm

  • Minimum Hole Diameter:   0.25 mm

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