RK3568 Android PCB motherboard

  • Layer:   6L

  • Substrate:   FR4 S1000H

  • Board Thickness:   1.6mm

  • Panel Size:   155*161.6mm/2

  • Outer Copper Thickness:   35μm

  • Inner Copper Thickness:   30μm

  • Minimum Hole Size:   0.20mm

  • Line Width/Spacing:   3/3.5mil

  • Surface Finish:   ENIG 2μ''

Related Products