RK3399 intelligent terminal all-in-one motherboard

  • Layers:   8

  • Material:   FR4 Tg150

  • Board Thickness:   1.6mm

  • Panel Size:   242*170mm/2

  • Outer Layer Copper Thickness:   35μm

  • Inner Layer Copper Thickness:   35μm

  • Minimum Via Hole:   0.20mm

  • Minimum BGA:   0.35mm

  • Line Width/Space:   4/4mil

  • Surface Finish:   ENIG 2U"

Related Products