A PCBA that passes all functional tests at the end of production cannot be cleared for delivery without further checks. For high-reliability products such as automotive, medical, and outdoor energy storage electronics, the answer is no. There is one more process after functional testing and before packaging and shipment: High-Temperature Burn-in.
Burn-in test refers to powering on and running circuit boards continuously at temperatures above ambient for a set duration (ranging from several hours to dozens of hours). This process exposes latent defects prior to shipment. It differs from Functional Circuit Test (FCT): FCT verifies whether the board works at this moment, while burn-in verifies whether it can keep working over time.
Electronic product failures follow the classic bathtub curve: the failure rate is high in the early stage, then enters a stable period, and rises again at end-of-life. Early failures are mostly caused by component batch defects, subtle soldering defects, cold solder joints, and thermal stress cracks. These defects often remain hidden during short-duration room-temperature tests, yet quickly surface under accelerated conditions of high temperature plus continuous power supply.
High-temperature burn-in compresses the early segment of the bathtub curve within the production line: potential faulty boards fail in the factory instead of at the customer site. For automotive, medical, outdoor and other high-reliability applications, the cost of an on-site failure (recalls, downtime, safety hazards) far exceeds the cost of burn-in.
Note that burn-in is not mandatory for all boards. It is an acceptance item defined per customer requirements and product grade. Consumer products with short lifecycles generally skip burn-in, whereas it is almost essential for high-reliability products.
How to demonstrate the real value of burn-in testing on the production floor? Take our factory’s burn-in room as an example: it adopts independent power supply and metering to accurately calculate the actual power consumption for each batch of boards. We charge customers based on power consumption with fully transparent cost breakdowns. Customers can clearly see the burn-in duration and power usage of each batch instead of receiving an opaque lump-sum charge.
There are two core burn-in parameters: temperature and duration. Customers specify burn-in requirements (XX°C for X hours) in product specifications or reliability requirements, and we implement the standard and record burn-in curves and results for every batch.
On the production line, burn-in is normally arranged after functional testing: FCT to confirm normal functionality → burn-in (continuous power-on under high temperature) → retest. Retesting may reuse the FCT setup or adopt simplified sampling inspection, focusing on confirming no new failures are introduced during burn-in. This "Test — Burn-in — Retest" workflow intercepts early failures before shipment.
Our factory’s complete back-end process chain: Programming → Testing → Burn-in → Conformal Coating / Potting → Assembly → Labeling → Packaging. Burn-in is not an isolated process; it is one link in the full reliability chain. Combined with processes such as conformal coating and potting, it enables high-reliability product delivery.
Need to design a burn-in test solution for high-reliability circuit boards? Send us your product requirements, and we will help you secure this critical pre-shipment quality gate.
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